Advancements in the Cu Pillar Based PCB Microfluidic System Integration with SiGe BiCMOS Technology

This paper reports our recent efforts in the advancements in the integration of the novel copper pillar based PCB microfluidic system for sub-THz microfluidic sensor applications. A thermo-compression bonding process has been exploited for the assembly of high performance SiGe BiCMOS technology to PCB microfluidic system in order to achieve better microfluidic performances compared to a reflow soldering process. The various aspects related to thermo-compression bonding process such as optimization of the bonding parameters, the material preferences, and the additional procedures to increase the feasibility of the process are addressed. Furthermore, the fluidic characterization solution for the proof of concept is demonstrated by taking into consideration the electrical connectivity.