On-Chip Microwave Photonic System Through Multi-Component Micro-Transfer Print Integration

We demonstrated a photonic integrated circuit (PIC) with heterogeneously integrated InP-based lasers and uni-travelling carrier photodiodes (UTC-PD) for microwave photonics applications. The InP components are integrated via the micro-transfer printing (MTP) technique, which allows scalable manufacturing process of the microwave photonic chips. We used the photonic circuit to form an external cavity with the transfer printed laser device and achieved tunable single frequency lasing for use in heterodyne radio frequency (RF) generation. The heterogeneously integrated UTC-PDs had 80 GHz bandwidth, and we validated RF generation on UTC-PD with the emission from an on-chip laser.