A 135 GHz Aperture-Coupled Antenna for D2D Communication Using Fused Silica and eWLB Technology

This paper presents, for the first time, an antenna design using a combination of a fused silica-based radiating element with an embedded wafer-level ball grid array (eWLB). This approach overcomes the limitations of standard eWLB antenna designs, ensuring enhanced performance and reliability for high-frequency applications. The aperture-coupled antenna operates at a frequency of 135 GHz, thus optimally meeting the requirements of the desired band for device to device (D2D) communication applications. The antenna gain, reflection coefficient, and radiation patterns were measured in the frequency range from 110 GHz up to 170 GHz (D-Band) using a probe-based antenna measurement system and compared with corresponding simulation results. The aperture-coupled antenna shows a relative bandwidth of 12.5 % and achieves a maximum gain of 9 dBi.