Moisture and Temperature Impact on the Delamination in ICs during Soldering

This article investigates the impact of temperature and humidity during the soldering process on integrated circuits (ICs). It presents a study on how external factors affect ICs using Scanning Acoustic Microscopy (SAM) in various scanning modes: A-scan, C-scan, B-scan, and a combined mode of C-scan + Relative Threshold Gate (RTG). The research focuses on how variations in temperature and humidity levels can influence the structural integrity and functionality of integrated circuits during soldering. The findings highlight the importance of controlling soldering conditions and underscore the necessity of employing methods like SAM for early detection and analysis of delaminations and defects, which are critical for ensuring the reliability and longevity of integrated circuits.