Combined Footprint - Results and Conclusions: Review

The article reviews the development of a new soldering method with the application of a solder paste with a combined footprint, which allows to ensure optimal individual soldering of each solder joint in the electronic module in a single soldering process (reflow soldering). The achievements of the research of the method over time, as well as the work of many researchers on improving soldering by adding various materials to the solder - metals, oxides, ceramics, nanomaterials and others - are reviewed. In the conclusions, it is emphasized that by using the obtained results and by means of analysis with statistical methods and machine learning, a software module can be created in the design softwares to determine the individual conditions for optimal soldering of each solder joint in the designed electronic module and this information can be loaded directly for execution by production machines (Jet printers).