A System-in-Package for Smart Microphone with Ultra-Low Power AI Co-Processor

This paper presents a compact and ultra-low power System in Package (SiP) for AI processing of voice signal. The proposed SiP is composed of a MEMS microphone and AI SoC, where the MEMS microphone and AI SoC are connected through wire bonding. The AI SoC integrates analog front-end, power management, clock generation, analog signal processor (ASP), OTP, SRAM and configurable NPU. The SiP smart microphone achieve ultra-low system power by replacing audio ADC and DSP with ASP. The high integration of the SiP requires only voltage supply to accomplish the Keyword Spotting (KWS) and Voice Activity Detector (VAD). The Software Development Kit (SDK) can configure the AI SoC for various tasks. The compact AI SoC designed with size of $1.7 \ \text{mm}\times 1.5 \ \text{mm}$ and pads locate only in two edges. The operating power consumption is l00-290uA and KWS accuracy reach 95%.