Surface Activated Bonding for Hybrid and All-Metal 3D (AM3D) Interconnect

We proposed a new 3D interconnect structure as an alternative to hybrid bonding, called All-Metal 3D (AM3D) interconnect [1], in which two devices are bonded not in a hybrid bonding structure but in Cu pad and plane electrodes. No bonding on the dielectric is needed; therefore, the bonding process is greatly simplified. Any processes for Cu-Cu bonding may be applied to this structure. The surface activated bonding (SAB) has the most potential since it is completed at room temperature.