BiCMOS BEOL Coupon Fabrication and Micro Transfer Printing for Heterogeneous Integration Applications

Micro Transfer Printing (μTP) technology enables heterogenous integration of micro-structures and micro-devices on non-native substrates. For utilizing the heterogenous integration of passive components with μTP technology, print-ready BiCMOS Back-end-of-line (BEOL) coupons are designed and fabricated. With the proposed printing method, fabricated BiCMOS BEOL coupons are successfully printed on a Silicon dioxide (SiO2) deposited Silicon (Si) target wafer without necessity of adhesives between the coupon and the target wafer. Moreover, the developed process enables the flexible heterogenous integration of BiCMOS BEOL passive components on various substrates for high performance electronic devices.