Trench-Based Fully Integrated Capacitors for Power Delivery in Heterogeneous Integration Platforms

High-density integrated capacitors are a crucial requirement for high power integrated power delivery methodolo-gies. Despite significant improvements in the density of integrated capacitor technologies, further advancements are still necessary for the on-chip accommodation of high-power density converters. Two novel integrated deep trench capacitor (DTC)-based devices, specifically, a hybrid metal-insulator-metal (MIM)-DTC and a Finger-DTC, are proposed in this paper. A comprehensive set of electrical models for the characterization of each device in terms of key performance metrics, including capacitance density, parasitic resistance/inductance, and leakage current, are provided. Results indicate that the proposed hybrid MIM-DTC device and Finger-DTC device improve the capacitance density of conventional DTCs up to, respectively, 48.15% and 36.23%. Furthermore, the proposed electrical models exhibit a high accuracy of less than 4.89% error when verified with standard multiphysics tools.