Highly Efficient Modeling of Solder Balls and Their Visco-plastic Behavior Applying the Energy Conserving Sampling and Weighting Method

The increasing complexity of automotive and industrial electronic control units does not allow the use of regular finite element analyses for complete design optimization regarding thermo mechanical reliability. In particular, the high number of solder balls, which require a fine resolution due to the non-linear material behavior, greatly increases the calculation effort. Therefore, this paper presents a new approach to obtain reduced models of the solder balls using the Energy Conserving Sampling and Weighting method. The method allows the combination of the reduced models with the remaining regular finite element model. This significantly reduces the calculation effort while maintaining high accuracy.