Re-Integrating a Reduced-Order Model into Finite Element Environment for Thermo-Mechanical Reliability Analysis in Microelectronics

Model order reduction technology is capable of generating highly accurate, but compact reduced-order models from large-scale finite element models. Such reduced-order models are not only more efficient, but also help safeguard the intellectual property, as the details of the material properties and model geometry are encrypted. Hence, those models are well suited for the exchange along the supply chain. In practice, re-integrating the reduced-order models into finite element analysis tools is crucial for this proces. In this work, we present a thermo-mechanical superelement model of a package, which is extracted from the reduced-order model and can be easily re-integrated into finite element analysis and coupled there to the printed circuit board model. The re-integration of the superelement into finite element environment speeds up the computational time while preserving the accuracy of the original model.