Innovative System-in-Package Building Blocks for Future Space Applications

This paper deals with the development of System in Package building blocks for both power and digital space application. The first building block focuses on embedding technology for Power converter featuring high current and very low voltage. A conversion cell building block using transistors GaN as fast switching element and their control electronics was developed using solder embedded technology with R-1566S Flame Retardant (FR4) material. The second building block concerns build-up substrate for advanced digital System-in-Package (SiP). Considering the high pin count dies with fine pitch to fan out, the build-up substrate resulted in a core substrate surrounded by 6 build-up materials on both sides namely a 6-N-6 structure. Resin Coated Copper (RCC) R-G740M resin presenting ultra low modulus and very low Dielectric constant (Dk) was selected as build-up material. For both building blocks, the materials physico-chemical characteristics were analyzed. Then test vehicle architectures were defined taking into account space application specificities as well as design for manufacturing (dfm) rules. Finally, test vehicles were manufactured and initial characterizations were made including visual inspection, X-Ray technique, and cross-section. Finally, the testing approach for reliability evaluation in space condition was defined based on existing International Process Circuit (IPC) and European Cooperation for Space Standardization (ECSS) standards for conventional Printed Circuit Board (PCB) and assembly qualification.