No Warpage and Fast Cure: UV-Molding for FOWLP/FOPLP

FOWLP and FOPLP provide means to manufacture highest end devices at low cost. One driver for cost is the carrier size, i.e. the wafer diameter or the panel format: The larger the carrier, the lower the cost for a single package. However, by driving these dimensions up, warpage of the setup (wafer or panel) gets more severe, as CTE mismatches take effect more and more, complicating handling and downstream processes after molding. This work introduces the concept of utilizing UV cure for large area encapsulation in FOWLP/FOPLP, supported by experimental data regarding reliability and warpage performance. Furthermore, virtual performance analysis using FEA simulations is presented for further insights into molding compound properties and their contribution to package performance.