Advancing Chiplet Architecture Through Heterogeneous Integration on Laser-processed Glass Substrates

With the relentless drive for enhanced computing performance and system integration, the semiconductor industry is transitioning from traditional organic substrate packaging to innovative glass core integrations. This paper explores chiplet architecture heterogeneous integration within glass substrates, enabled by advancements in Laser Induced Deep Etching (LIDE) technology. Traditional organic substrates, though widely used, face limitations in thermal management, signal integrity, and interconnect density. In contrast, glass substrates offer superior thermal stability, electrical performance, and mechanical strength. LIDE technology, involving precise laser modification and chemical etching, creates high-quality microstructures such as Through-Glass Vias (TGVs) and cavities. These features are critical for high-density interconnects and embedding components, enhancing the performance and reliability of advanced semiconductor packages. This research underscores the potential of glass substrates and LIDE technology in revolutionizing high-performance electronic packaging.