Digital twin in manufacturing: Transient Thermo-Mechanical Simulations

The Digital Twin (DT) has received a lot of research attention and discussion in recent years. It contributes significantly to the industry's transition from the conventional era of trial and error to the contemporary industrial mode. Simulation and computer-aided engineering (CAE) are important components of the DT concept. Manufacturing DT is a virtual representation of the actual processes that may be planned for and enhanced. Additionally, DT offers an infinite number of measurement points and variables without using large, expensive sensors during the actual process.Surface mount technology (SMT) components are frequently attached to printed circuit boards (PCB) using reflow soldering. Employing DT in manufacturing, will end up in reduction in production time and cost, and CO2 emissions from the production line.In this article, a Digital Twin based multiphysics model is used, powered by the Ansys simulation environment, to conduct a comprehensive virtual analysis of the reflow process from both thermo-fluid dynamic and structural perspectives. Thermo-fluid dynamic results are coupled to a structural analysis tool to simulate the stresses and possible deformations during the reflow process. Thermo-fluid dynamic and structural simulation results were compared against the experimental test results done in the Nokia Factory in Oulu, Finland.