DIE-PKG-PCB Co-Design Methodology for High-Speed Interfaces for Complex Automotive SoCs

With shrinking technology, increasing functionality and performance including high speed interfaces imposes major challenges for DIE, Package and PCB Co-design to meet overall system level electrical specifications (e.g. Power, Performance, Area, Timing, PISI, IR Drop, Thermal, EMI/EMC) and BOM Cost (e.g. DIE, PKG, PCB Cost).In this paper, we present DIE-PKG-PCB Co-Design Methodology for high speed interfaces to optimize DIE, PKG and PCB overall to meet system level electrical specifications as well as to optimize the overall system cost for complex Automotive SoCs.