Application of ICP-MS to identify the source of Metallic Contamination

Inductively Coupled Plasma Mass Spectrometry (ICP-MS) is being widely used in semiconductor industry to analyze the metallic contents of chemicals used in the wafer fabrication process. In this paper, application of ICP-MS to identify the types and source of metallic contaminations in solvents used in the lithography step, which subsequently translated to become particles affecting the lithography process and causing the wafers to fail was discussed. Two case studies were presented in this paper.