An Evaluation of Anisotropic Ink for Improved Reliability of Printed Electronics

A major challenge towards fabricating printed, hybrid circuitry on conformal surfaces is the interconnection of a commercial off the shelf (COTS) packaging with printed AM traces. This work details the advantages of implementing COTS anisotropic ink (Creative Materials 124-19A) as method for hybrid AM interconnect processes. The resulting structures were tested for both reliability and in various test-bed applications including discrete, passive components and IC packaging. The designs demonstrate a robust connection on low surface roughness surfaces.