Ku-K Dual Band Antenna-In-Package Design of Array of Subarray for Beamforming Applications

A Ku-K dual-band antenna array is proposed for antenna-in-package beamforming applications, comprising eight subarrays integrated on an interposer board using ball-grid-array (BGA) packaging. The array incorporates commercially available beamforming chipsets and includes four Ku-band and five K-band miniaturized antenna elements within the novel dual-band subarray. Simulation results indicate potential array gains of 19.6 dBi in Ku-band and 21 dBi in K-band. Currently in the preliminary stage, the design will undergo fabrication as a proof-of-concept with planned improvements. Measured results will be presented at upcoming conferences, marking the next step in validating the proposed dual-band antenna array.