Novel Polyesterimide-SiO2-Polyamide Nanocomposites and Their Dielectric Properties

This study is part of a comprehensive research project aimed at developing innovative composite materials by leveraging the advantageous properties of nanofillers. This paper focus on the dielectric properties of a new composite composed of polyesterimide resin with $1 \mathrm{wt}. \%$ silicon dioxide $\left(\mathrm{SiO}_{2}\right)$ nanoparticles, polyamide nonwoven nanofabric, and polyamide film. The dielectric properties are thoroughly evaluated using several key parameters: absorption/resorption currents and their derivative metrics, relative permittivity, dissipation factor across varied temperatures and frequencies, and dielectric strength. These metrics are crucial for assessing the composite’s performance under various electrical and temperature stresses, essential for high-voltage applications. The outcome is a novel four-component material with enhanced dielectric properties compared to traditional composites. Polyamide nonwoven nanofabric significantly improved dielectric strength without compromising other dielectric parameters. On the other hand, polyamide film served as the carrier material that enhanced mechanical properties, which are discussed in a separate paper. This material could potentially replace conventional insulating materials in specific applications, thanks to its enhanced performance and reliability. A significant advantage of used resin is its VOC-free nature and low viscosity, which facilitate easy impregnation and effective dispersion of nanoparticles.