A Fan-Out Wafer-Level Package Technology for Millimeter-Wave Monolithic Integrated Circuits

For the packaging and integration of millimeter-wave monolithic integrated circuits, a fan-out wafer-level package (FOWLP) technology is developed. TMV arrays and molybdenum copper blocks are introduced to achieve good performance of vertical interconnection, grounding and thermal dissipation. A Ka-band low noise amplifier is packaged to demonstrate the proposed method. Within the frequency range of 24~33 GHz, the gain and the noise figure of the packaged chip are degraded by less than 1 and 0.1 dB, respectively, when compared with those of the die.