A Collaborative Optimization Methodology for 2.5-D Advanced Package Considering Thermal and Power Integrity

In this paper, a collaborative optimization methodology for 2.5-D advanced package considering thermal and power integrity is proposed. A design flow including thermally-aware placement and decoupling capacitor optimization is driven by an improved adaptive genetic algorithm. In the first stage, the methodology comprehends the critical design indexes such as the area, wirelength and temperature. Based on the determined placement, the on-chip decoupling capacitor optimization task is conducted to suppress the impedance of the cascaded power delivery network. The developed methodology provides a new paradigm of electronic design automation tools for complex 2.5-D integrated microsystem in the future.