Finite Element Analysis and Experimental Verification of Structural Performance in Thermoelectric Cooler Modules

This study conducts an in-depth finite element analysis of the structural performance of Thermoelectric Cooler (TEC) modules. By reasonably simplifying the model, a finite element model of the TEC module, comprising a ceramic substrate, copper plate, solder layer, and P/N-type semiconductors, was established. Using orthogonal experimental design, the effects of different thicknesses of copper plates, solder layers, and ceramic substrates on the performance of the TEC module were investigated. Modal analysis revealed the natural frequencies and deformation modes of the module structure, identifying the thickness of the solder layer as a critical factor affecting the natural frequency. Experimental verification demonstrated the accuracy of the finite element model, with an error range of $1.50 \%$ to $4.37 \%$. The research results provide theoretical and experimental support for the design and optimization of TEC modules.