Impact of CMOS BEOL and Heterogenous Packaging Process Conditions on the Performance of On-Chip Antenna Arrays for EM Radiation Monitoring

This study investigates the impact of CMOS Back-End-Of-Line (BEOL) and heterogeneous packaging process conditions on the performance of on-chip antenna arrays designed for electromagnetic (EM) radiation monitoring in integrated circuits (ICs). On-chip antennas can be crucial for detecting aging and electromigration for enhancing IC reliability. We analyze how BEOL conditions, including high temperature anneals and varied annealing durations, as well as metal thickness, affect the return loss and coupling of on-chip antennas.