Design of Data Processing Microsystem Packages Based on High Temperature Co-Fired Ceramics

With the development of miniaturization, integration, and multifunctional electronic devices, micro system packages based on high-temperature co-fired ceramics (HTCC) have attracted more attention due to their excellent machinability, high integration, and high reliability. Taking a universal data processing microsystem ceramic package as the research object, this paper elaborates in detail on the layout, simulation, and verification of the microsystem package, which has guiding significance for the design, simulation, and verification of data processing micro system packages based on high-temperature co-fired ceramics.