Application of Nano Copper Paste in Large-Area Sintering: A Study on Enhancing Its Sintering Performance

Silicon carbide power chips require interconnection materials with high thermal and electrical conductivity, stability at high temperatures, and resistance to electro migration. Nano-metal sintering technology, particularly using nano-silver and nano-copper, has emerged as a promising solution. This study investigates the large-area sintering (LAS) performance of different substrates and printing thicknesses. The results show that pure copper (Cu) substrates provide superior bonding compared to nickel (Ni)-plated ones, and the sintered layer thickness varies significantly with stencil thickness. The presence of a cross-shaped channel improves the volatilization of organic compounds, reducing porosity. These findings highlight the potential of nano-metal sintering materials in enhancing the reliability and performance of high-power chips.