Design and Characteristics of Thermoelectric and Liquid Cooling Composite Active Heat Dissipation of Power Electronics

Heat dissipation is an unavoidable problem in the field of power electronics, resulting in numerous failures and performance degradation. A composite heat dissipation of thermoelectric and liquid cooling was realized by utilizing the interstitial space between N-type and P-type thermoelectric materials as a microchannel for liquid cooling, and this composite heat dissipation can effectively improve the heat dissipation capability of power electronics. The influence of the different heat dissipation methods, including natural heat dissipation, thermoelectric cooling, liquid cooling, and composite heat dissipation of thermoelectric and liquid cooling, on the operating temperature of power electronic was firstly analyzed and compared. Furthermore, the effects of thermoelectric driving voltage and fluid flow rate on the operating temperature of power electronics were further investigated under the combined heat dissipation method of thermoelectric and liquid cooling. The results indicate that thermoelectric and liquid cooling composite active heat dissipation is a more effective active thermal management technique compared to single thermoelectric or liquid cooling.