Transmission Performance and Crosstalk Analysis of TSV array Based on Differential GSSG Layout

In the realm of large-scale 3D integrated circuits, a substantial number of Through-Silicon Vias (TSVs) must be integrated to realize vertical signal transmission. TSV arrays play a crucial role in achieving high-density 3D vertical interconnection. The presence of crosstalk and noise between TSVs can significantly impede transmission performance. Consequently, there has been a notable focus on developing compact, high-performance TSV arrays. In this work, the transmission characteristics and crosstalk noise of TSV arrays based on differential GSSG (Ground-Signal-Signal-Ground) layout are investigated. A series of signal TSV and ground TSV arrays were designed to study the high-frequency performance of different TSV arrays. The simulation outcomes reveal that single TSV exhibit the lowest insertion loss for both signal lines and ground lines. Signal TSV array tends to induce more severe crosstalk compared to single TSV, whereas multiple ground TSVs can enhance noise shielding and ensure signal integrity. Furthermore, the study extensively investigated the influence of aspect ratio and TSV pitch on transmission performance.