Simulation of Heat Dissipation of CPU Chip in Smart Phone

As smartphone technology advances, enhanced performance in smaller form factors presents significant thermal management challenges, particularly for CPU chips. Herein, we studied the heat dissipation mechanism of CPU chips under various conditions, using computational fluid dynamics. We focus on three aspects: mobile phone design, test environment, and modeling type. Comparing temperature data, we found chip arrangement affects PCB layout and overall phone temperature. Simplified CPU models speed up the simulation process. Using JEDEC RJA and RJBtests, we obtained CPU thermal resistance to air and to PCB. The research aims to understand how design parameters, such as chip layout and cooling mechanisms, affect heat dissipation, thereby informing manufacturers on effective thermal management strategies.