Research on Reliability Risk-Based Microstructure Evaluation Method for Integrated Circuits

The reliability of design, process, inner microstructure and material used in integrated circuit is the key to determining the inherent reliability level of the device itself. With the continuous updating and iteration of integrated circuit manufacturing processes, the size of process microstructure is getting smaller and the integration degree is getting higher. As a result, issues related to circuit design layout, manufacturing process, packaging process, and material reliability have gradually become key influencing factors affecting the reliability level of integrated circuits themselves. How to conduct quality inspection and reliability evaluation on newly developed integrated circuits, effectively identify defects and weak links that affect device quality and application reliability, and fully verify the true reliability level of devices, has very important practical significance. This study proposes a reliability risk based integrated circuit microstructure evaluation method, which analyzes the key elements that affect device reliability in advance and establishes corresponding testing and evaluation items. Through physical testing and verification of the device, the real reliability risks of the device can be identified and provide a basis for device design, process improvement, selection, and application design. This method aims to provide integrated circuit users with an effective means of quality inspection and reliability evaluation to ensure the inherent reliability of microelectronic devices.