Revealing the Effect of Chemical Bonds on Interface Thermal Resistance of Graphene Film/Cu Laminate Structure

To meet the demand for thermal management for heat generated by high-power devices quickly and eliminate the temperature of hot spots, this work introduces an enhanced heat dissipation material manufacturing method and reveals the effect of chemical bonds on the interface thermal resistance of graphene film/Cu laminate structure. The heat dissipation material consists of a graphene film/Cu laminated structure interconnected through carboxyl polydopamine chemical bonds. This structure effectively combines the good mechanical properties of Cu with the exceptional thermal properties of graphene film. Chemical functionalization using different solvents is employed to introduce active groups between graphene film and Cu interfaces. By utilizing chemical bonds to enhance phonon transport at the interfaces, the thermal resistance of the graphene film/Cu substrate inter-connection structure is markedly reduced. The effects of different functionalization durations and their effects on thermal resistance were investigated, and the results show that the thermal resistance of the interconnection structure can reach as low as 2.92 ± 0.08 K/W after eight hours of functionalization of the Cu substrate. This chemically bonded graphene film/Cu composite presents a practical heat dissipation solution for high-density electronic packaging.