Optimization of the Adhesion and Thermal Conductivity of Thermal Interface Materials for Chip Immersion Cooling via Grafting Polar Groups

Conventional heat dissipation methods struggle to meet chips' thermal management needs, leading to the adoption of submerged liquid cooling technology. Traditional thermal interface materials (TIMs) have limitations in thermal conductivity and adhesion. To address this, a novel TIM is developed using methylhydrosiloxane polydimethylsiloxane and vinyl terminated polydimethylsiloxane as matrix, with 2-Hydroxyethyl acrylate (HEA) grafting to enhance adhesion properties. Our research also explored the effect of varying spherical aluminum powder sizes. The optimized TIMs achieve a high thermal conductivity of 5.20 W m
⁻¹
K
⁻¹
, adhesion strength of 4.18 ± 0.18 MPa, and adhesion energy of 729.55 ± 282.63 J m
⁻²
. Our TIMs effectively address thermal management challenges of chip, providing an efficient solution for submerged liquid cooling systems and advancing electronic packaging technology.