Revolutionizing Power Module Manufacturing: Large Area Sintering with Silver Pastes for Enhanced Performance and Cost-Effectiveness

To meet the increasing heat dissipation requirement of high-power-density power modules, novel packaging materials are greatly necessary. Ag sintering with excellent thermal conductivity, is not only gradually applied in the die attach, but also considered as the best candidate to replace the traditional Pb-containing solder alloy for large-area module attach. In this study, experimental research and Finite Element Analysis (FEA) simulations have been conducted to compare the performance of modules employing traditional soldering with large area sintering. The findings unequivocally illustrate the superior thermal and structural characteristics of large area sintering with silver pastes. The results demonstrate that large area sintering with silver pastes enables the attainment of equivalent power outputs with a diminished number of Silicon Carbide (SiC) chips, while upholding acceptable Tj thresholds, thereby furnishing substantial cost-effectiveness. Evidently, large area sintering with silver pastes is exceptionally well-suited for the forthcoming generation of power modules, offering heightened performance, augmented power density, and noteworthy cost-effectiveness. In summary, large area sintering with silver pastes is well-suited for future power modules, offering higher performance, increased power density, and improved cost-effectiveness.