High Thermal Conductive Liquid Metal/Hydroxy Silicone Oil Thermal Grease with Anti-Leakage

With the development of microelectronic devices, miniaturization and high-power density pose new challenges to chip thermal management, effective thermal management during chip packaging is paramount. Thermal grease, as a type of thermal interface material, finds widespread application in the field of electronic packaging. However, there still exist challenges regarding how to further enhance the thermal conductivity of thermal grease and address issues such as filler leakage. Compared to other rigid fillers, eutectic gallium-indium alloy offers unique advantages as a filler in manufacturing high-performance thermal interface materials, meeting the required thermal and mechanical behaviors. Here, we present a thermal grease prepared by blending hydroxy silicone oil with eutectic gallium-indium alloy, characterized by high thermal conductivity and non-corrosiveness. Experimental investigations into the thermal properties and rheological behavior of this thermal grease, along with analyses of its surface and internal structure, elucidate its mechanisms. It is evident that liquid metal/polymer thermal grease holds vast potential in the realm of chip packaging.