Electrodeposition and Mechanical Properties of Gradient-Structured Cu with (220) Preferred Orientation

The technology of electroplated copper is widely used in the manufacturing of interconnect materials for semiconductor devices. However, the conventionally electro-deposited copper foils are characterized by variable thermal stability, diminished tensile strength, and inadequate ductility, which are detrimental to their robustness and reliability in practical scenarios. To enhance the mechanical properties of electroplated copper, this paper employed a direct current electro-deposition method to fabricate copper foils with a (220) preferred orientation. Initially, samples were prepared at different current densities, and it was found that the current density significantly affects the microstructure and mechanical properties of the copper foil. Subsequently, by uniformly varying the current density, gradient-structured copper foils were prepared. The testing revealed that these samples exhibited enhanced tensile strength, reaching up to 411 MPa, while also achieving a commendable elongation rate of 6.8%. The findings of this paper are beneficial for improving the mechanical properties of electroplated copper foils and provide a reference for optimizing the mechanical properties of other materials.