Application and Optimization of Laser-Assisted Bonding (LAB) in Multi-Chip Integration

Multi-chip integration on the large substrate for Chiplets technology has emerged as a prevailing trend in the semiconductor industry. Thus, large substrates are urgently demanded. However, warpage is quite serious for this kind of substrate. This study presents a solution to this problem by laser-assisted- bonding (LAB) technology, which utilizes instantaneous laser heating to achieve melting and bonding. We have developed a LAB-X-100 series equipment that effectively bonds the flip-chip devices to a large substrate. This largely reduces the substrate warpage from over 150
$\mu \mathrm{m}$
to less than 50
$\mu \mathrm{m}$
.