Study on the Welding Fastness of CQFP Ceramic Package Lead

The Ceramic Quad Flat Pack (CQFP) is a common form of integrated circuit packaging, which is composed of high-temperature co-fired ceramics (HTCC) and metal leads, and has a wide range of applications in military, aviation and aerospace fields. In order to meet the requirement of high reliability, the welding strength of CQFP ceramic package lead is studied. In this paper, the finite element simulation software is used to simulate the test process of lead tension. After establishing the model, the force of each node is simulated and analyzed by cell grid division. The stress value of each element node and the stress distribution cloud map are evaluated when the lead is subjected to 7N vertical pulling force. The simulation results show that the maximum stress value is mainly distributed at the back foot of the lead solder. According to the simulation results, the lead and solder are optimized and the lead tension test is carried out. After optimization, the lead tension test results of the structure increased from 3N to 13.2N, and the welding strength of the lead is improved. The simulation results are consistent with the experimental results, which provides an important reference for the research of the welding fastness of CQFP leads.