Study on Opto-Mechatronic Hybrid Integration Technology Based on 2.5D Advanced Packaging

Based on the development trends of micro-electro-mechanical systems (MEMS) and micro-optoelectronic systems, in this paper, a hybrid integration technology for opto-mechatronic micro systems based on 2.5D advanced packaging technology is proposed for the integration of optoelectronic detectors, MEMS sensors, and processing chips. Utilizing a collaborative design approach, a hybrid integration interposer based on Through-Silicon Via (TSV) technology was designed, with TSV diameter/depth of
$10 \ \mu \mathrm{m}/100 \ \mu \mathrm{m}$
, Redistribution Layer (RDL) line width of
$25 \ \mu \mathrm{m}$
, and optical well window of
$600\times 900 \ \mu \mathrm{m}$
. The interposer integrates high-aspect ratio TSV technology and large-size optical well window etching technology compatibly. This hybrid integration technology with wire-free interconnections methods reduces the traditional wire-bond interconnection resistance, improves the signal quality of optoelectronic detectors and conditioning chips, and reduces parasitic effects in optoelectronic systems. The hybrid integration process and design technology of opto-mechatronic microsystems developed based on TSV technology have reduced the system volume from
$50\text{mm}\times 50\text{mm}\times 10\text{mm}$
to
$11\text{mm}\times 11\text{mm}\times 2.45\text{mm}$
while ensuring high performance. This technology is laying the foundation for the development of 2.5D/3D opto-mechatronic hybrid integration based on interposers.