Research on the Application of Active Thermoelectric Cooling Technology in the Field of Power Chip Heat Dissipation

With the continues progress of the advanced integrated circuit manufacturing technology, power chips are rapidly developing towards high integration, miniaturization, and high-frequency. The improvement of chip performance is accompanied by a continuous increase in power consumption and heat flux density. Overheating is a significant cause of power chip failure, which severely affects the chip's stability, reliability, and lifespan. Therefore, it becomes urgent to develop efficient and sustainable thermal management solutions for power chips. Thermoelectric cooling technology, based on the Peltier effect, can convert electrical energy into thermal energy. Currently, thermoelectric cooling devices (TEC) can achieve continuous and precise control over the cooling temperature by adjusting the operating voltage and current, with a cooling temperature reach -70°C at room temperature. Moreover, thermoelectric cooling devices have several advantages, such as high temperature control precision, fast response speed, compact structure, no moving parts, and low maintenance requirements. Therefore, developing thermoelectric cooling technology and applying it to efficient cooling and temperature control of power chips is of great significance for promoting the development of power chips towards integration, miniaturization, and higher frequencies. In order to solve the problem of efficient temperature control and heat dissipation in power chips, this study will apply thermoelectric cooling technology to the field of power chip heat dissipation. Based on a established temperature control, testing, and feedback system, the operation performance of the power chip will be characterized to evaluated the temperature control effects of the thermoelectric cooling device against traditional air cooling and liquid cooling methods. Through this research, the feasibility and effectiveness of active thermoelectric cooling technology for temperature control and heat dissipation in power chips can be thus verified.