Study on the Influence of Automatic Mounting Parameters of Conductive Adhesive on the Reliability of Components

Conductive adhesive bonding is widely used in hybrid integrated circuit products, and is the main form of package interconnection for capacitors, two triodes and IC chips. With the continuous reduction of the size of internal components in highly reliable hybrid integrated circuits and the continuous improvement of circuit assembly density, the control and optimization of adhesive parameters, including dispensing form, dispensing amount and mounting pressure, have an increasing impact on the reliability of component packaging. The problems of conductive adhesive silver migration, interface delamination and contact resistance stability have become the main failure modes of conductive adhesive bonding interconnection. This paper intends to carry out research on optimization of automatic mounting parameters of conductive adhesive bonding components. Through testing and analyzing the identification process parameters and mounting process parameters of automatic mounting equipment, effective mounting parameters for different bonding components are obtained. The results show that the installation accuracy, pass rate and contact resistance stability of the components can be greatly improved by using the optimized mounting parameters. Meanwhile, the mounting efficiency can also be significantly improved by optimizing the program and parameters.