Design and Simulation Study of a Novel Diamond Based Composite Heat Dissipation Baseplate

Currently, power module packaging is developing towards higher power density, which requires increasingly higher heat dissipation capacity in packaging. This article designs a novel diamond based heat dissipation baseplate, introduces a new packaging material based on IGBT power module packaging floor structure, thus optimizes and innovates the structure and heat dissipation path. The thermal and mechanical properties of diamond and diamond/copper composite materials as baseplate materials are analyzed through junction temperature thermal simulation and thermal stress warping simulation. The results indicate that novel diamond based composite heat dissipation baseplate has significantly improved thermal conductivity and thermal stress warping compared to the traditional DBC/solder/copper baseplate packaging structure. At the same packaging conditions, the junction temperature drops by 16.64
${}^{\circ} \mathrm{C}$
, the warping deformation caused by solder reflux process reduced from 1.1365 mm at length and 0.715007 mm at width to 0.39598 mm and 0.2431203 mm, respectively.