Through Glass via (TGV) Filling Process With Conductive Silver Paste Based on 3D Printing Technology

Filling is one of the most costly and intricate steps in through glass via (TGV) manufacturing. Conductive silver paste has a remarkable bonding strength with glass and excellent electrical properties. In this study, conductive silver paste was used to fill TGVs with a diameter of 100 μm and a depth of 400 μm via 3D printing technology, and Daisy chain wiring was performed at the same time. Subsequent testing evaluated the electrical and mechanical properties of the produced Daisy chain. The results demonstrate a resistivity of 8.42× 10^-6 Ω·m for the silver paste within the through vias, and the silver paste in the wiring layer exhibits a peak shear force of 23 gf. In conclusion, the integration of 3D printing technology for filling TGVs and wiring with conductive silver paste significantly simplifies the TGV filling process, and the electrical and mechanical performance are reliable.