Research on Plastic Encapsulated Microelectronics Construction Analysis Technology Based on Failure Mechanism

Plastic encapsulated microelectronics (PEMs) is widely applied in fields such as artificial intelligence, electronic communication, automotive electronics, and household appliances, due to its excellent performance, light weight and low cost. PEMs, as an important electronic device packaged with polymer composite materials, have a significant impact on the performance of electronic devices due to their reliability and stability. However, due to the non-airtightness and inherent moisture absorption of plastic packaging materials, various failure problems could be found in PEMs during the installation and use. In the context of low cost and high reliability of electronic components, how to identify the reliability risks of PEMs has become a focus of attention. construction analysis (CA), as a risk analysis method for the design, structure, materials, and manufacturing process of electronic components through physical, chemical, and other analytical techniques, could be used to analyze the reliability risks of PEMs to determine whether it can meet the technical requirements of special application environments. In this paper, the procedure of PEMs construction analysis would be summarized. And the structural weaknesses and sensitive stresses of PEMs would be analyzed through typical cases such as delamination and poor bonding. Then construction analysis based on the failure mechanism of PEMs would be proposed. Moreover, the structural risk of PEMs would be evaluated via stress injection, non-destructive and destructive analysis techniques. The targeted optimization suggestions based on construction analysis results could proposed to improve the reliability of PEMs and provide strong support for the stable operation of electronic devices.