Optimization of Pin Fin Structure for Uniform Temperature Distribution in Multi-Chip Parallel-Connected Power Modules

In electronic devices, power modules are usually used to control and convert electrical energy, and are widely used in various fields, such as communications, industrial control, automotive electronics, etc. With the increase of power density and performance requirements of electronic equipment, power modules will generate a lot of heat at high power operation. If the heat generated by these power modules cannot be effectively dissipated, the device temperature will rise, affecting the performance and service life of electronic components. In serious cases, may cause device performance degradation, frequent failures or even damage. Therefore, optimizing the heat dissipation design of the power module, improving the heat dissipation efficiency and reducing the temperature is of great significance for improving the stability and extending the service life of the equipment. In this paper, the finite element analysis of ANASYS ICEPAK. was carried out to establish the fluidity-heat coupling analysis model of different radiator structures and the chip junction temperature distribution under different PIN spacing and shape was simulated. The results show that the heat dissipation performance of hexagonal PIN is better than that of cylindrical PIN structure. PIN spacing 1.7 minimum pressure drop, minimum junction temperature difference between chips, the best heat dissipation effect. Finally, the optimal heat sink structure design is found, and the heat dissipation performance of the module is optimized.