Simulation Analysis of Tin Absorption Morphology of CCGA Solder Columns Based on Energy Minimization

Tin absorption on the solder column represents a unique phenomenon occurring during the assembly process of CCGA devices. This phenomenon, where solder ascends along the column, diminishes the effective length of the CCGA solder column, thereby significantly impacting the reliability of the solder joints assembled. Two CCGA geometric models were established for 90Pb10Sn column and 80Pb20Sn column with spiral copper, respectively, considering the influence of factors such as solder column structure, solder volume, column wetting angle and pad wetting angle on the solder joint morphology. Based on the principle of energy minimization, the actual solder joint morphology under different factor levels was calculated, providing a reasonable process combination for actual production processes.