LC Virtual Separation Method: An Accurate Modelling Approach for Equivalent Circuit Models of Complex TSV Structures

In this paper, the capacitance characteristics of the TSV structure are analysed from the viewpoint of electromagnetic simulation and circuit simulation. It is concluded that the method of superposing and summing the capacitance of each decomposed structure is not applicable to this structure. On this basis, a method to obtain an equivalent circuit model (ECM) of the TSV structure is proposed based on de-embedding - the LC virtual separation method. The model is validated by testing in the frequency range of 0–40 GHz.