Structural Design and Technology of Microchip-Packaged DC/DC Converters

Microchip-packaged DC/DC Converters is the latest generation of DC/DC Converters based on modular semiconductor packaging, pushing the integration, lightweight, and miniaturization of DC/DC converters to new height. This article investigates the structural design, thermal design, packaging process technology of microchip-packaged DC/DC Converter. The microchip-packaged DC/DC converts adopts a “sandwich” structure, packaged-size of
$\mathbf{38.72}\mathbf{mm}\times \mathbf{22.8}\mathbf{mm} \times \mathbf{7.21}\mathbf{mm}$
, output power of 320W, and power density of
$\mathbf{818}\mathbf{W}/\mathbf{in}^{\mathbf{3}}$
. Compared with traditional packaging DC/DC converters, the power density increased by more than 200%. Through reliability verification, it has been proven that the operating temperature range of the developed microchip packaging DC/DC converter can reach -55°C -125°C, meets the high reliability requirements in the aerospace field.