Numerical Modeling and Validation of Silicone-Type Receiving Layer for Micro-LED Laser-Based Mass Transfer

Micro-LED display technology distinguishes itself within a plethora of display technologies by delivering high photoelectric conversion efficiency, superior energy yield ratio, as well as response times in the nanosecond regime. As one of the highly effective ways for mass transferring of Micro-LEDs, laser-based mass transfer can rapidly and accurately transfer Micro-LED chips to a target substrate. However, the scarcity of in-depth research into receiving materials for Micro-LED laser-based mass transfer and the limitations of contemporary testing methodologies have significantly impeded the advancement of Micro-LED receiving materials. In this study, we propose a numerical modeling approach for a silicone-type receiving layer material tailored to Micro-LED laser-based mass transfer process and corroborate the feasibility and practical utility of this model through bespoke impact testing. Furthermore, utilizing this technique, we predict the impact response of silicone-type receiving material under conditions typical for Micro-LED dimensional mass transfer. The findings reveal that for a silicone-type receiving layer material with a thickness of
$\mathbf{273}\ \boldsymbol{\mu} \mathbf{m}$
subjected to impact velocities of 5 m/s, 10 m/s, 15 m/s, and 20 m/s, the corresponding experimental impact depths are:
$\mathbf{14.95}\ \boldsymbol{\mu} \mathbf{m},\ \mathbf{20.56}\ \boldsymbol{\mu} \mathbf{m},\ \mathbf{25.99}\ \boldsymbol{\mu} \mathbf{m}$
, and
$\mathbf{69.2}\ \boldsymbol{\mu} \mathbf{m}$
—closely mirroring the simulated depths of
$\mathbf{11.18}\ \boldsymbol{\mu} \mathbf{m},\ \mathbf{14.93}\ \boldsymbol{\mu} \mathbf{m},\ \mathbf{21.49}\ \boldsymbol{\mu} \mathbf{m}$
, and
$\mathbf{63.96} \boldsymbol{\mu} \mathbf{m}$
, thus affirming the viability of the modeling technique. Predictive experiments at Micro-LED scale suggest that within a certain range, increases in the thickness and area of silicone-type layer imprints reduce the chip's final kinetic energy, indicating a direct, positive correlation between the dimensions of the receiving material and the efficiency of chip reception. This research presents pivotal insights into the future landscape of Micro-LED packaging materials and enriches our understanding of the laser-based transfer process.