Optimization Design and Flow Field Characteristics Study of Cleaning Process Tank for Wafer Wet

The wafer cleaning process is an important link throughout the entire wafer manufacturing and packaging, and is one of the important factors affecting wafer performance and yield. As integrated circuit feature sizes shrink and wafer sizes increase, coupled with the increase in requirements for wafer surface granularity indicators, the requirements for controlling the uniformity of process chemical tank cleaning in tank cleaning equipment are getting higher and higher. Based on fluid dynamics and mechanical design theory, this paper conducts design research on the chemical tank of the wet cleaning process based on the working characteristics of the wafer tank cleaning equipment. The mathematical model and numerical model of the tank fluid field were established, and finite element analysis software was used to analyze the internal flow field of the tank. In order to improve the uniformity of the flow of chemical liquid in the tank, the effects of the incident angle of the liquid inlet hole, the diameter of the liquid inlet hole, and the number of liquid inlet holes on the uniformity of the flow of chemical liquid in the tank were analyzed, and the structural parameters of the tank were optimized. Establish a numerical model of the tank structural field, perform fluid-solid coupling analysis on the tank, and obtain the stress and displacement change nephograms of the tank. This article has certain reference value for the design optimization of the process chemical tank in tank cleaning equipment and the analysis of the flow field and structure of the tank.