Study on the Effect of Test Condition on Thermal Resistance of the Press-Pack IGBT Module

Press-Pack IGBT modules (PP-IGBT) are the key components in an electronic system. It is of great importance to study on the thermal resistance especially for thermal resistance, reliability, and life prediction. But to measure the thermal resistance accurately is relatively difficult. It is necessary to study the influence of test conditions on the thermal resistance of the PP-IGBT for better measurement. The influence of six factors of test conditions is studied in this paper. In this paper, experiments were designed and carried out, and finite element method (FEM) and structure function were also used for the verification and the analysis. The measurement process of on-state voltage at low current of temperature sensitive electrical parameter (TSEP) method was used to measure the thermal resistance. The experimental results show that the gate voltage, flow velocity and heating current have little effect on the thermal resistance under normal operating conditions, and pressure, ambient temperature and sensing current affect the thermal resistance in various ways.